Highly integrated low-power platform streamlines the development of premium intelligent edge systems and devices for demanding industrial, commercial, and consumer use cases
Supports dual MIPI CSI cameras and dual MIPI DSI displays
Rich connectivity including Wi-Fi 6, Gigabit Ethernet, and optional 4G LTE support
Taipei, Taiwan, October 18, 2022 – VIA Technologies, Inc. today announced that it will debut the VIA SOM-9X12 Module featuring the MediaTek Genio 1200 SoC at Japan IT Week Autumn 2022, which takes place at the Makuhari Messe in Tokyo from October 26 to 28.
Combining support for dual MIPI CSI cameras and dual MIPI DSI displays with Wi-Fi 6, BT 5.2, Gigabit Ethernet, and optional 4G LTE, the VIA SOM-9X12 and the companion VIA VAB-912 carrier board provide rich I/O expansion and high-speed connectivity options to facilitate the development of premium intelligent edge systems and devices for industrial, commercial, and consumer use cases.
“The VIA SOM-9X12 Module delivers the performance, flexibility, and reliability required to accelerate the transition from proof of concept to volume production for next-generation intelliegent edge systems and devices,” commented Richard Brown, VP of International Marketing, VIA Technologies, Inc. “With its rich camera, display, and wireless connectivity features, this powerful and scalable platform enables our customers to take full advantage of emerging opportunities in industrial, commercial, and consumer markets.”
About the VIA SOM-9X12 Module
The VIA SOM-9X12 is designed for premium intelligent edge systems and devices with advanced processing, computer vision, and multimedia capabilities. An optional VIA VAB-912 carrier board is available to speed up development. Key features include:
2.0GHz MediaTek Genio 1200 octa core SoC featuring four Cortex A78 @ 2.2GHz and four Cortex A55 @ 2.0GHz processors with an integrated dual-core APU (AI Processor Unit) for deep learning, neural network acceleration, and computer vision applications and a five core graphics engine capable of advanced 3D graphics.
Support for dual MIPI CSI cameras and dual MIPI DSI displays
Advanced wireless and network connectivity including dual-band 802.11ac Wi-Fi 6, and Gigabit Ethernet, as well as an integrated SIM card slot and optional 4G LTE adaptor
Three USB 2.0 ports, up to three USB 3.1 ports, one M.2 B-key slot, and one MicroSD card slot
16GB eMMC flash memory and 4/8GB system memory
SMARC 2.11 compliant 82mm x 80mm (3.22″ x 3.15″) module form factor
3.5” SBC carrier board measuring 146mm x 102mm (5.75″ x 4.17″)
Yocto 3.5 and Android 11 BSP
Learn more about the VIA SOM-9X12 Module here.
Images related to this press release are available here.
About VIA Technologies, Inc.
VIA Technologies, Inc. is a global leader in the design and development of intelligent automotive, industrial, building, and edge solutions for the most demanding use cases and deployment environments. Headquartered in Taipei, Taiwan, VIA operates a global network that links the high-tech centers of the US, Asia, and Europe and spans a customer base that includes many of the world’s leading hi-tech, manufacturing, and transportation enterprises.
