VIA Technologies, Inc.

Mediatek Genio 700 SoC

Mediatek Genio 700 SoC

Dual display and dual MIPI CSI-2 camera support

Dual display and dual MIPI CSI-2 camera support

Rich wireless connectivity options

Rich wireless connectivity options

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Overview

Accelerate the development of advanced edge AI systems and devices with the VIA SOM-5000 module. Powered by the MediaTek Genio 700 Octa-core processor, this highly integrated low-power platform delivers blistering AI, graphics, video, and computing performance required for the most demanding industrial, commercial, and consumer use cases.

Combining Gigabit Ethernet, dual display and dual MIPI CSI-2 camera support with optional dual-band Wi-Fi 6 and 4G LTE, the VIA SOM-5000 provides flexible expansion and connectivity options to meet diverse application needs. For the full hardware specifications of the VIA SOM-5000 module and VIA SOMDB7 carrier board, download the following datasheet.

VIA SOM-5000 Module featuring MediaTek Genio 700 SOC usage scenarios

Hardware

VIA SOM-5000 Module featuring MediaTek Genio 700 SOC

VIA SOM-5000 Module

VIA SOMDB7 carrier board

VIA SOMDB7 Carrier Board

The VIA SOM-5000 module is powered by a MediaTek Genio 700 Octa-Core Processor combining two Cortex-A78 cores operating at 2.2GHz and six Cortex-A55 cores running at 2.0GHz with an integrated AI processor providing up to 4.0 TOPS for deep learning, neural network acceleration, computer vision applications and HiFi5 audio processing.

When combined with the VIA SOMDB7 carrier board, the VIA SOM-5000 module provides a wealth of camera and display integration options, including support for two MIPI CSI-2 cameras, a MIPI DSI display, plus, two HDMI and LVDS displays each. High-speed connectivity can be enabled through two Gigabit Ethernet ports, an integrated SIM card slot, and M.2 slots for optional dual-band Wi-Fi 6 and 4G LTE. Two USB 3.1 ports, an ADC/GPIO pin header, and a MicroSD card slot allow additional I/O configuration.

The VIA SOM-5000 module measures 82mm x 50mm (3.22″ x 2″). The VIA SOMDB7 carrier board is based on an SBC form factor measuring 151mm x 134mm (5.94″ x 5.28″).

Software

VIA SOMDB7 carrier board

VIA SOM-5000 BSP

The VIA SOM-5000 BSP supports Android 13, Yocto 4.0, and Debian 12. Software customization services that speed up time to market and minimize development costs are also available.

v1.1.0
2024-11-22
v1.0.0
2024-10-04
[2.09GB]
v1.0.0
2024-11-01
Important: By downloading these software packages, you indicate your acceptance of the VIA Software License agreement. If you do not agree with any of the terms and conditions, do not continue to download the software.

Get In Touch

The VIA SOM-5000 module can be purchased as a discrete module or together with the VIA SOMDB7 carrier board and optional 4G wireless module. To see how it can be tailored for your specific use cases, contact us for more information!

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VIA Technologies, Inc.