In today’s fast-paced world, smart devices need to be quick, efficient, and versatile. VIA has made significant strides in boosting the performance of smart devices. Learn how we can achieve fast boot times, support multiple cameras with optimized performance, and smoothly facilitate developing with multiple I/O options.
Fast Boot Time for Smart Devices
One of the primary goals for any smart device is to minimize the time it takes to boot up. VIA leverages the MediaTek Genio processors as the core processing unit for its edge computing systems. Here’s how it works:
Optimized Hardware: MediaTek’s powerful processors are designed to handle complex tasks efficiently. By using this advanced hardware, VIA ensures that smart devices can process commands swiftly.
Efficient Software Integration: VIA’s Board Support Packages (BSP) include various optimizations to reduce boot time. The BSP is a layer of software that ensures the hardware components and the operating system work seamlessly together, speeding up the initial startup process.
Multiple Cameras with Optimized Performance
Modern smart devices often need to handle multiple cameras simultaneously, such as for face recognition and card reading. An example of this being used is in major clinics and pharmacies in Japan, which is allowing fast, secure authentication for incoming patients using facial recognition AI.
VIA’s edge computing solutions make this possible through several key innovations:
Dual Camera Functionality: VIA’s BSP Camera Tuning allows devices to use dual cameras effectively. This means a device can perform face recognition and read a card at the same time, ensuring quick and secure access.
Image Quality Tuning: VIA provides tools to fine-tune image quality. This ensures that the cameras produce clear and accurate images, essential for both security and user satisfaction.
Anti-Spoofing Technology: VIA integrates Time-of-Flight (ToF) sensors to prevent spoofing attempts. This technology, although not originally part of Android, has been successfully ported and utilized by VIA to increase security.
Efficient Development with Flexible I/O Options
Ensuring robust and user-friendly functionality is crucial for smart devices. VIA’s approach includes several strategies to achieve this:
USB Bus CDC Functionality: VIA’s BSP includes support for USB bus CDC (Communications Device Class) functionality. This enables efficient communication between the device and a host PC, enhancing overall device performance.
Easy I/O Integration: VIA’s SmartETK (Embedded Tool Kit) simplifies development by providing tools for managing various I/O options. This makes it easier for developers to integrate different input and output interfaces, streamlining the development process and improving device versatility.
Accelerating Development Time
Beyond these technical features, VIA also focuses on speeding up the development process:
Standardized Products: VIA uses System on Module (SOM) as a standard product, which simplifies the development of custom carrier boards. This approach reduces development time significantly.
Simultaneous Development: By developing applications alongside hardware, VIA shortens the overall development cycle, bringing products to market faster.
Leveraging Existing Solutions: VIA builds upon existing standard products, allowing for higher layers of application development without starting from scratch.
As they become more ubiquitous, smart devices need to adapt and improve to match the ever-evolving environments they are used in. Through a combination of advanced hardware, efficient software integration, and innovative development strategies, VIA continues to push the boundaries of what smart devices can achieve and ensure that they meet the high expectations of today’s consumers.
Discover how VIA’s Intelligent Edge Solutions can transform your smart devices today: